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NTMTS001N06CTXG - onsemi

Description: Ultra Low RDS(on); Low Gate Charge and Capacitance; Pb−Free and Halogen Free/BFR Free

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PCB Footprints
NTMTS001N06CTXG - onsemi PCB footprint - Other - Other - DFNW8 8.3x8.4, 2P_1
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3D Models
NTMTS001N06CTXG - onsemi  - 3D model - Other - DFNW8 8.3x8.4, 2P_1
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NTMTS001N06CTXG Details

  • Manufacturer Part Number:

    NTMTS001N06CTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    DFNW-8

  • Manufacturer Package Code:

    507AP

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-02-01

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    887 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    376 A

  • Drain-source On Resistance-Max:

    0.00091 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    107 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    244 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NTMTS001N06CTXG Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for NTMTS001N06CTXG is -55°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet, and ensure the device is operated within the specified voltage and current ranges.
  • For optimal thermal performance, use a multi-layer PCB with a thermal pad connected to a heat sink or a thermal interface material. Ensure good thermal conductivity and minimal thermal resistance.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper handling and storage procedures to prevent ESD damage.
  • Follow the recommended soldering temperature and time profiles in the datasheet. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the device is properly aligned and secured during assembly.

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NTMTS001N06CTXG Overview

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