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NTMTSC4D2N10GTXG - onsemi

Description: MOSFET - Power, Single N-Channel, TDFNW8, 100 V, 4.2 m, 178 A

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NTMTSC4D2N10GTXG - onsemi PCB footprint - Other - Other - TDFNW8 8.30x8.40x0.92, 2.00P CASE 507AS ISSUE C
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NTMTSC4D2N10GTXG - onsemi  - 3D model - Other - TDFNW8 8.30x8.40x0.92, 2.00P CASE 507AS ISSUE C
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NTMTSC4D2N10GTXG Details

  • Manufacturer Part Number:

    NTMTSC4D2N10GTXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    TDFNW-8

  • Manufacturer Package Code:

    507AS

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    506 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    178 A

  • Drain-source On Resistance-Max:

    0.0042 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    158 pF

  • JESD-30 Code:

    R-PDSO-F8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.9 W

  • Pulsed Drain Current-Max (IDM):

    2558 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NTMTSC4D2N10GTXG Frequently Asked Questions (FAQs)

  • The datasheet provides a recommended PCB layout for thermal performance, but engineers often ask for more specific guidance. Onsemi recommends a 2-layer or 4-layer PCB with a solid ground plane, and to place thermal vias under the IC to improve heat dissipation.
  • To optimize output voltage accuracy, ensure that the input voltage is within the recommended range, and use a high-precision voltage reference. Additionally, consider using a low-ESR output capacitor and minimizing the PCB trace resistance to reduce voltage drops.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, engineers may ask about the maximum operating temperature range for specific applications. The answer is that the device can operate up to 150°C, but with reduced performance and lifespan.
  • The NTMTSC4D2N10GTXG has built-in OVP and UVP features. To handle these events, connect the OVP and UVP pins to a suitable voltage reference, and ensure that the input voltage is within the recommended range. Additionally, consider adding external protection circuits for added robustness.
  • The recommended input capacitor value is 10uF to 22uF, with a low-ESR ceramic or tantalum capacitor. This helps to filter out input noise and ensure stable operation.

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