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NTP53321G0JTZ - NXP

Description: Interface - Specialized NTP53321G0JT

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NTP53321G0JTZ - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT96-1
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NTP53321G0JTZ - NXP  - 3D model - Small Outline Packages - SOT96-1
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NTP53321G0JTZ Details

  • Manufacturer Part Number:

    NTP53321G0JTZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2020-01-15

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Additional Feature:

    Operating temp for EEPROM Write operation is -40 to 85 deg cel

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NTP53321G0JTZ Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11542, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The NTP53321G0JTZ has a high power dissipation, so thermal management is crucial. Use a heat sink, ensure good airflow, and follow the thermal design guidelines in the datasheet and application notes to keep the junction temperature below 150°C.
  • The input capacitor should be a low-ESR, high-frequency capacitor (e.g., X7R or X5R dielectric) with a value between 4.7 μF and 10 μF, and a voltage rating of at least 25 V. The capacitor should be placed close to the VIN pin to minimize noise and ensure stable operation.
  • The output voltage can be adjusted by connecting a resistor divider network between the VOUT pin and the GND pin. The datasheet provides a formula to calculate the required resistor values for a specific output voltage. Additionally, the device has a built-in voltage regulator, which can be enabled or disabled using the EN pin.
  • The NTP53321G0JTZ has a built-in overcurrent protection (OCP) feature, which limits the output current to prevent damage. However, the OCP threshold is not adjustable, and the device may not detect very short-duration overcurrent events. Additional external protection mechanisms may be necessary for specific applications.

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NTP53321G0JTZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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