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NTS0102DP,125 - NXP

Description: NXP NTS0102DP,125, Voltage Level Shifter, 3-State, 8-Pin TSSOP

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NTS0102DP,125 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - NTS0102DP,125
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NTS0102DP,125 - NXP  - 3D model - Small Outline Packages - NTS0102DP,125
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NTS0102DP,125 Details

  • Manufacturer Part Number:

    NTS0102DP,125

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-2

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Delay-Max:

    8.8 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.3 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NTS0102DP,125 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane and a thermal relief pattern under the device. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • The NTS0102DP,125 has built-in ESD protection, but it is still important to follow proper ESD handling and storage procedures to prevent damage. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Yes, the NTS0102DP,125 is suitable for high-frequency applications up to 1 GHz. However, it is essential to follow proper PCB layout and design guidelines to minimize signal loss and ensure signal integrity.
  • To troubleshoot issues with the NTS0102DP,125, start by verifying the power supply voltage, checking for proper PCB layout and design, and ensuring that the device is operated within its recommended operating conditions. Use oscilloscopes and logic analyzers to debug signal integrity issues.

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NTS0102DP,125 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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