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NTS0102GD,125 - NXP

Description: Voltage Level Translator Bidirectional 1 Circuit 2 Channel 50Mbps 8-XSON, SOT996-2 (2x3)

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PCB Footprints
NTS0102GD,125 - NXP PCB footprint - Other - Other - NTS0102GD,125-1
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3D Models
NTS0102GD,125 - NXP  - 3D model - Other - NTS0102GD,125-1
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NTS0102GD,125 Details

  • Manufacturer Part Number:

    NTS0102GD,125

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    XSON-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT996-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Delay-Max:

    8.5 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    LATCH

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.3 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NTS0102GD,125 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermal interface material, and follow the recommended operating conditions and derating guidelines outlined in the datasheet.
  • The NTS0102GD,125 has built-in ESD protection, but additional measures can be taken, such as using ESD protection diodes, following proper handling and storage procedures, and implementing latch-up prevention techniques in the PCB design.
  • Yes, the NTS0102GD,125 is suitable for high-frequency applications due to its low propagation delay and high bandwidth. However, ensure proper PCB layout, signal integrity, and termination to minimize signal reflections and losses.
  • To troubleshoot issues, start by verifying the power supply, signal integrity, and PCB layout. Use oscilloscopes and logic analyzers to debug the signal paths, and consult the datasheet and application notes for guidance on specific issues.

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NTS0102GD,125 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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