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NTS0102GF,115 - NXP

Description: Translation - Voltage Levels DUAL XCVR OPEN DRAIN AUTO DIRECT SENSING

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PCB Footprints
NTS0102GF,115 - NXP PCB footprint - Other - Other - NTS0102GF,115-2
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NTS0102GF,115 - NXP  - 3D model - Other - NTS0102GF,115-2
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NTS0102GF,115 Details

  • Manufacturer Part Number:

    NTS0102GF,115

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    XSON-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT1089

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Delay-Max:

    8.5 ns

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    LATCH

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    2.3 V

  • Supply Voltage1-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NTS0102GF,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation across the full temperature range, follow the recommended operating conditions, use a suitable thermal design, and consider using a thermal protection circuit to prevent overheating.
  • The NTS0102GF,115 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and use ESD-protective packaging to prevent damage.
  • Yes, the NTS0102GF,115 is suitable for high-reliability and automotive applications, but ensure you follow the recommended operating conditions, and consider additional testing and validation for your specific use case.
  • To troubleshoot issues, start by reviewing the datasheet and application notes, checking the device's operating conditions, and using diagnostic tools such as oscilloscopes or logic analyzers to identify the root cause of the issue.

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NTS0102GF,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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