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NTSB30U100CTT4G - onsemi

Description: Fine Lithography Trenchbased Schottky Technology for Very Low Forward Voltage and Low Leakage; Fast Switching with Exceptional Temperature Stability; Low Power Loss and Lower Operating Temperature; Higher Efficiency for Achieving Regulatory Complianc; Low Thermal Resistance; High Surge Capability; PbFree and HalideFree Packages are Available

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PCB Footprints
NTSB30U100CTT4G - onsemi PCB footprint - Other - Other - D2PAK 3 CASE 418B−04 ISSUE L
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3D Models
NTSB30U100CTT4G - onsemi  - 3D model - Other - D2PAK 3 CASE 418B−04 ISSUE L
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NTSB30U100CTT4G Details

  • Manufacturer Part Number:

    NTSB30U100CTT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK 2 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    418B-04

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.8 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    160 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    675 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

NTSB30U100CTT4G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NTSB30U100CTT4G is -40°C to 150°C.
  • To ensure reliability, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing thermal resistance.
  • The recommended PCB layout and thermal design for the NTSB30U100CTT4G involves using a multi-layer PCB with thermal vias, a heat sink, and a thermal interface material to minimize thermal resistance.
  • To handle the high current handling capability of the NTSB30U100CTT4G, ensure that your PCB design can handle high currents, use adequate trace widths, and provide sufficient thermal management.
  • The NTSB30U100CTT4G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Additionally, latch-up prevention measures include using a latch-up immune design and following proper PCB layout guidelines.

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NTSB30U100CTT4G Overview

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Part Image NTSB30U100CTG onsemi

Rectifier Diode, Schottky, 1 Phase, 2 Element, 15A, 100V V(RRM), Silicon