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NTST30U100CTG - onsemi

Description: Fine Lithography Trenchbased Schottky Technology for Very Low Forward Voltage and Low Leakage; Fast Switching with Exceptional Temperature Stability; Low Power Loss and Lower Operating Temperature; Higher Efficiency for Achieving Regulatory Complianc; Low Thermal Resistance; High Surge Capability; PbFree and HalideFree Packages are Available

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PCB Footprints
NTST30U100CTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 CASE 221A ISSUE AK
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NTST30U100CTG - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 CASE 221A ISSUE AK
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NTST30U100CTG Details

  • Manufacturer Part Number:

    NTST30U100CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220 3 LEAD STANDARD

  • Pin Count:

    3

  • Manufacturer Package Code:

    221A

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    100 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.65 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    160 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    675 µA

  • Reverse Test Voltage:

    100 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

NTST30U100CTG Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for NTST30U100CTG is a thermal pad with a minimum size of 2.5mm x 2.5mm, with a 1.5mm diameter thermal via connecting to a larger copper area on the bottom layer for heat dissipation.
  • To ensure reliability, it's essential to follow the recommended thermal design guidelines, including providing adequate heat sinking, using a thermal interface material, and keeping the junction temperature (Tj) below the maximum rating of 150°C.
  • The maximum allowed voltage transient for NTST30U100CTG is 120% of the maximum rated voltage (100V) for a duration of less than 100ms, as specified in the datasheet.
  • Yes, NTST30U100CTG can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reduce reliability.
  • The recommended gate drive voltage for NTST30U100CTG is between 10V and 15V, with a gate current of 1A to 2A, to ensure reliable switching and minimize power losses.

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NTST30U100CTG Overview

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Part Image NTST30100CTH onsemi

Rectifier Diode, Schottky, 1 Phase, 2 Element, 15A, 100V V(RRM), Silicon, TO-220AB

Part Image NTST30100CTG onsemi

Rectifier Diode, Schottky, 1 Phase, 2 Element, 15A, 100V V(RRM), Silicon, TO-220AB