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NUD3124DMT1G - onsemi

Description: Provides Robust Interface between D.C. Relay Coils and Sensitive Logic; Capable of Driving Relay Coils Rated up to 150 mA at 12 Volts; Replaces 3 or 4 Discrete Components for Lower Cost; Internal Zener Eliminates Need for Free-Wheeling Diode; Meets Load Dump and other Automotive Specs

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Symbol
NUD3124DMT1G - onsemi - PCB symbol
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PCB Footprints
NUD3124DMT1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-74 CASE 318F-05
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3D Models
NUD3124DMT1G - onsemi - 3D model - SOT23 (6-Pin) - SC-74 CASE 318F-05
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NUD3124DMT1G Details

  • Manufacturer Part Number:

    NUD3124DMT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Package Description:

    SC-74, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    57 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    3 mm

  • Number of Functions:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.5 mm

NUD3124DMT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, ensure that the device is not exposed to thermal stress or thermal shock.
  • The NUD3124DMT1G has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the NUD3124DMT1G is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is still important to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • Use a systematic approach to troubleshoot issues. Check the power supply voltage, input signals, and output signals. Use an oscilloscope to visualize the signals and identify any anomalies. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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NUD3124DMT1G Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like NUD31, or try a keyword search, such as Peripheral Drivers

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