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NUD3124LT1G - onsemi

Description: Provides Robust Interface between D.C. Relay Coils and Sensitive Logic; Capable of Driving Relay Coils Rated up to 150 mA at 12 Volts; Replaces 3 or 4 Discrete Components for Lower Cost; Internal Zener Eliminates Need for Free-Wheeling Diode; Meets Load Dump and other Automotive Specs

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Symbol
NUD3124LT1G - onsemi - PCB symbol
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PCB Footprints
NUD3124LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - EEV-EB2G4R7Q
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3D Models
NUD3124LT1G - onsemi - 3D model - SOT23 (3-Pin) - EEV-EB2G4R7Q
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NUD3124LT1G Details

  • Manufacturer Part Number:

    NUD3124LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G3

  • Length:

    2.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Seated Height-Max:

    1.11 mm

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Width:

    1.3 mm

NUD3124LT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness is recommended for the thermal pad, and it should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • The NUD3124LT1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2 kV human body model (HBM) and 200 V machine model (MM) ESD protection is recommended.
  • Yes, the NUD3124LT1G is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specified parameters.
  • Start by verifying the device's pin connections and voltage supply. Check for any signs of overheating, electrical overstress, or physical damage. Use oscilloscopes or logic analyzers to debug the device's behavior and identify any anomalies.

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NUD3124LT1G Overview

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NUD3124LT1G Alternates

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Part Image NUD3124LT1 onsemi

Buffer/Inverter Based Peripheral Driver, 1 Driver, MOS, PDSO3