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NUF2221W1T2G - onsemi

Description: Provides USB Line Termination, Filtering and ESD Protection; Single IC Offers Cost Savings; Bi-directional EMI Filtering Prevents Noise from Entering/Leaving the System; Compliance with IEC61000-4-2 (Level 4) 8 kV (Contact) 15 kV (Air); Flexible Pull-up Line Termination to Meet USB 1.1 Low Speed and High Speed Specification; ESD Ratings: Machine Model = C Human Body Model = 3B; Pb-Free Package is Available

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PCB Footprints
NUF2221W1T2G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-88(SOT-363) CASE 419B-02 ISSUE Y
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3D Models
NUF2221W1T2G - onsemi  - 3D model - SOT23 (6-Pin) - SC-88(SOT-363) CASE 419B-02 ISSUE Y
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NUF2221W1T2G Details

  • Manufacturer Part Number:

    NUF2221W1T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Package Description:

    6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Differential Output:

    YES

  • Interface IC Type:

    OTHER TERMINATOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Signal Lines:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Pull-up Resistance-Nom:

    1500 Ω

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NUF2221W1T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Additionally, use a stable voltage source and decouple the power supply lines with capacitors to minimize noise and ripple.
  • Handle the device by the body, not the leads, to prevent damage. Avoid touching the leads or exposed pads to prevent electrostatic discharge (ESD) damage. Use an anti-static wrist strap or mat when handling the device.
  • To determine the suitable heat sink, calculate the maximum power dissipation (PD) using the formula PD = (VIN - VOUT) x IOUT. Then, select a heat sink with a thermal resistance (RθJA) that meets the calculated PD. Consult the datasheet for thermal resistance values.
  • To minimize EMI, use a multi-layer PCB with a solid ground plane, keep the power supply lines short and away from sensitive signals, and use shielding or filtering components as needed. Also, ensure the device is placed away from other noise-sensitive components.

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NUF2221W1T2G Overview

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