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NUP4000DR2G - onsemi

Description: Bi-Directional Surge Suppressor Array for High Speed Data Line Protection

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NUP4000DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NUP4000DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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NUP4000DR2G Details

  • Manufacturer Part Number:

    NUP4000DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    16.7 V

  • Clamping Voltage-Max:

    30 V

  • Configuration:

    SEPARATE, 4 ELEMENTS, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    15 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    15 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP4000DR2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the junction temperature within the recommended range.
  • The NUP4000DR2G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 1 kΩ resistance in series with the input pins and a 100 nF capacitor to ground is recommended to prevent ESD damage.
  • Yes, the NUP4000DR2G is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive-grade reliability. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly validated and qualified for the specific application.
  • To troubleshoot issues with the NUP4000DR2G, start by verifying the power supply voltage, checking for proper PCB layout and thermal management, and ensuring that the input and output pins are properly connected. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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NUP4000DR2G Overview

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