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NUP4106DR2G - onsemi

Description: Peak Power - 500W 8x20uS; ESD Rating:IEC61000-4-2 (ESD) 15kV (air) 8kV (contact); This is a Pb-Free Device

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NUP4106DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 NB CASE 751−07
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NUP4106DR2G - onsemi  - 3D model - Small Outline Packages - SOIC−8 NB CASE 751−07
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NUP4106DR2G Details

  • Manufacturer Part Number:

    NUP4106DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    TSOP-6

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.93

  • Breakdown Voltage-Min:

    5 V

  • Clamping Voltage-Max:

    15 V

  • Configuration:

    SINGLE, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    500 W

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    3.3 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP4106DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper biasing, make sure to follow the recommended operating conditions in the datasheet, including the input voltage range, output current, and operating temperature. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's essential to ensure proper thermal management and stay within the recommended operating temperature range.
  • To troubleshoot issues, start by verifying the input voltage, output current, and operating temperature are within the recommended ranges. Check for proper PCB layout, component selection, and thermal management. Use oscilloscopes or other diagnostic tools to identify any anomalies in the output voltage or current.
  • The NUP4106DR2G has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. For latch-up prevention, ensure that the device is properly biased and that the input and output pins are not subjected to excessive voltage or current.

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