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NUP4114HMR6T1G - onsemi

Description: Low Clamping Voltage; Small Body Outline Dimensions on SC88 Package:0.082 x 0.078 (2.10 mm x 1.25 mm); Low Body Height: 0.043 (1.10 mm); Standoff Voltage: 5.5 V; Low Leakage; Response Time is Typically < 1.0 ns; IEC6100042 Level 4 ESD Protection; These Devices are PbFree and are RoHS Compliant; AECQ101 Qualified and PPAP Capable for SZNUP4114; Meets UL 94 V-0; SZ prefix for automotive and other applications requiring unique site and control change requirements

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PCB Footprints
NUP4114HMR6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOP−6 CASE 318G−02
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NUP4114HMR6T1G - onsemi  - 3D model - SOT23 (6-Pin) - TSOP−6 CASE 318G−02
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NUP4114HMR6T1G Details

  • Manufacturer Part Number:

    NUP4114HMR6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP-6

  • Package Description:

    TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    318G-02

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    6.81

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    6.5 V

  • Clamping Voltage-Max:

    10 V

  • Configuration:

    COMPLEX, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5.5 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    5.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP4114HMR6T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system.
  • The NUP4114HMR6T1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2kV HBM and 100V MM protection is recommended.
  • Yes, the NUP4114HMR6T1G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required depending on the specific application.
  • The recommended soldering conditions are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. Follow the onsemi recommended soldering profile for optimal results.

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