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NUP4301MR6T1G - onsemi

Description: Low Capacitance (5 pf Maximum); Single Package Integration Design; Provides ESD Protection for JEDEC Standards JESD22 Machine Model = Class C Human Body Model = Class 3B; Protection for IEC61000-4-2 (Level 4) 8.0 kV (Contact) 15 kV (Air); Ensures Data Line Speed and Integrity; Fewer Components and Less Board Space; Direct the Transient to Either Positive Side or to the Ground; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique

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NUP4301MR6T1G - onsemi - PCB symbol
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PCB Footprints
NUP4301MR6T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-74 CASE 318F-05
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3D Models
NUP4301MR6T1G - onsemi - 3D model - SOT23 (6-Pin) - SC-74 CASE 318F-05
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NUP4301MR6T1G Details

  • Manufacturer Part Number:

    NUP4301MR6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Package Description:

    SC-74, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.11

  • Breakdown Voltage-Min:

    70 V

  • Configuration:

    COMPLEX, 4 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    8

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    70 V

  • Reverse Current-Max:

    2.5 µA

  • Reverse Test Voltage:

    70 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP4301MR6T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • The NUP4301MR6T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind.
  • Yes, the NUP4301MR6T1G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards or customer requirements.
  • Use a combination of visual inspection, thermal imaging, and electrical testing to identify the root cause of the issue. Check for proper PCB layout, thermal design, and component selection. Consult the datasheet and application notes for troubleshooting guidelines.

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NUP4301MR6T1G Overview

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