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NUP5120X6T2G - onsemi

Description: Protects up to 5 Lines in Single SOT-563 Package; ESD Rating of Class 3B (Exceeding 8kV) per Human Body Model and Class C (Exceeding 400V) per Machine Model.; Compliance with IEC61000-4-2 (ESD) 15kV (Air), 8kV (Contact); This is Pb-Free Device

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PCB Footprints
NUP5120X6T2G - onsemi PCB footprint - Other - Other - SOT−563, 6 LEAD CASE 463A ISSUE H
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NUP5120X6T2G - onsemi  - 3D model - Other - SOT−563, 6 LEAD CASE 463A ISSUE H
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NUP5120X6T2G Details

  • Manufacturer Part Number:

    NUP5120X6T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-563, 6 LEAD

  • Package Description:

    SOT-563, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    463A-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.98

  • Breakdown Voltage-Max:

    7.2 V

  • Breakdown Voltage-Min:

    6.2 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Configuration:

    COMMON ANODE, 5 ELEMENTS, 5 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    90 W

  • Number of Elements:

    5

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    3 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NUP5120X6T2G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Additionally, consider using a thermal interface material to improve heat transfer between the device and heat sink.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device is operated within the recommended temperature range to maintain reliability.
  • Use proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, including the use of ESD protection diodes and resistors.
  • The recommended soldering conditions are a peak temperature of 260°C, with a soldering time of 10-30 seconds. It is essential to follow the recommended soldering profile to prevent damage to the device.

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NUP5120X6T2G Overview

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