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NV25010DTHFT3G - onsemi

Description: Additional Identification Page with Permanent Write Protection; NV Prefix for Automotive and Other Applications Requiring Site and Change Control; SOIC and TSSOP 8-Lead Packages; 10 MHz SPI Compatible; SPI Modes (0,0) & (1,1); 16-byte Page Write Buffer; Self-timed Write Cycle; Hardware and Software Protection; Block Write Protection - Protect ¼, ½ or Entire EEPROM Array; Low Power CMOS Technology; 200 Year Data Retention; These Devices are Pb-Free, Halogen Free/BFR Free, and RoHS Compliant; Automotive Tempe

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PCB Footprints
NV25010DTHFT3G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8 4.4x3 CASE 948AL ISSUE O
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NV25010DTHFT3G - onsemi  - 3D model - Small Outline Packages - TSSOP8 4.4x3 CASE 948AL ISSUE O
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NV25010DTHFT3G Details

  • Manufacturer Part Number:

    NV25010DTHFT3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP-8

  • Package Description:

    TSSOP-8

  • Manufacturer Package Code:

    948AL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A001.a.2.a

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    10 MHz

  • Data Retention Time-Min:

    200

  • Endurance:

    300000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Memory Density:

    1024 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    128 words

  • Number of Words Code:

    128

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128X8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    5 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.002 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    4 ms

  • Write Protection:

    HARDWARE/SOFTWARE

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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NV25010DTHFT3G Overview

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