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NVD5C464NT4G - onsemi

Description: Low on-resistance; High current capability; 100% avalanche energy tested; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVD5C464NT4G - onsemi PCB footprint - Other - Other - DPAK (SINGLE GAUGE) TO-252 (369C) ISSUE F_1
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NVD5C464NT4G - onsemi  - 3D model - Other - DPAK (SINGLE GAUGE) TO-252 (369C) ISSUE F_1
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NVD5C464NT4G Details

  • Manufacturer Part Number:

    NVD5C464NT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    136 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    59 A

  • Drain-source On Resistance-Max:

    0.0058 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Pulsed Drain Current-Max (IDM):

    310 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVD5C464NT4G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The NVD5C464NT4G has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and use ESD-protective packaging. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges.
  • Yes, the NVD5C464NT4G is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions, and consider additional testing and validation for your specific use case.
  • Use a systematic approach to troubleshoot issues. Check the device's operating conditions, PCB layout, and thermal design. Verify that the device is operated within the recommended voltage, current, and temperature ranges. Consult the datasheet and application notes for guidance.

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NVD5C464NT4G Overview

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