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NVDS015N15MCT4G - onsemi

Description: Low RDS (ON); Low QG and Capacitance; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVDS015N15MCT4G - onsemi PCB footprint - Other - Other - NVDS015N15MCT4G-1
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NVDS015N15MCT4G Details

  • Manufacturer Part Number:

    NVDS015N15MCT4G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369C

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.12

  • Avalanche Energy Rating (Eas):

    1301 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    61.3 A

  • Drain-source On Resistance-Max:

    0.015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10.5 pF

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    107.1 W

  • Pulsed Drain Current-Max (IDM):

    382 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVDS015N15MCT4G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NVDS015N15MCT4G is -55°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. The device requires a Vgs (gate-source voltage) of 0V to 10V, and a Vds (drain-source voltage) of 0V to 150V. Additionally, ensure the device is operated within the recommended current ratings to prevent overheating and damage.
  • For optimal thermal management, it's recommended to use a PCB layout that provides good thermal conductivity and heat dissipation. This can be achieved by using a thick copper layer, thermal vias, and a heat sink. Additionally, ensure the device is mounted on a thermally conductive material, such as a metal core PCB or a heat sink, to dissipate heat efficiently.
  • To protect the device from ESD, follow proper handling and storage procedures. Use an ESD wrist strap or mat when handling the device, and store it in an ESD-protected package. Additionally, ensure the device is properly grounded during assembly and testing to prevent ESD damage.
  • The recommended soldering conditions for the NVDS015N15MCT4G are a peak temperature of 260°C, with a soldering time of 10-30 seconds. It's also recommended to use a solder with a melting point of 217°C to 220°C to prevent damage to the device.

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NVDS015N15MCT4G Overview

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