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NVMFS6H864NT1G - onsemi

Description: Small Footprint (5x6 mm); Low RDS(on); Low QG and Capacitance; NVMFS6H818NWF − Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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NVMFS6H864NT1G - onsemi PCB footprint - Other - Other - NVMFS6H864NT1G-2
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NVMFS6H864NT1G Details

  • Manufacturer Part Number:

    NVMFS6H864NT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SO-8FL / DFN-5

  • Package Description:

    SO-8FL, DFN5, 5 PIN

  • Manufacturer Package Code:

    488AA

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2018-08-02

  • Manufacturer:

    onsemi

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    21 A

  • Drain-source On Resistance-Max:

    0.032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    33 W

  • Pulsed Drain Current-Max (IDM):

    92 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVMFS6H864NT1G Frequently Asked Questions (FAQs)

  • Onsemi provides a reference design guide for PCB layout and thermal management. It's recommended to follow the guidelines for optimal performance and to minimize thermal resistance. A good thermal design should ensure that the junction temperature (Tj) remains below 125°C.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and derating guidelines. The device should be operated within the specified temperature range (-40°C to 150°C), and the junction temperature (Tj) should be monitored to prevent overheating.
  • The NVMFS6H864NT1G has built-in ESD protection, but it's still important to follow proper handling and storage precautions to prevent damage. Use anti-static wrist straps, mats, and packaging materials, and avoid touching the device's pins or exposed die.
  • The NVMFS6H864NT1G is not specifically designed or qualified for radiation-hardened or high-reliability applications. If you need a device for such applications, you should consult with onsemi's sales team or a qualified radiation-hardened component supplier.
  • Onsemi provides a soldering and assembly guide that outlines the recommended techniques and parameters for reflow soldering, wave soldering, and manual assembly. It's essential to follow these guidelines to ensure reliable connections and prevent damage to the device.

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NVMFS6H864NT1G Overview

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