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NVMFWS2D9N04XMT1G - onsemi

Description: Low RDS(on); Low QG and Capacitance; Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant; Small Footprint (5x6 mm)

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NVMFWS2D9N04XMT1G - onsemi PCB footprint - Other - Other - DFNW5 5x6  FULL−CUT SO8FL WF) CASE 507BA ISSUE A
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NVMFWS2D9N04XMT1G - onsemi  - 3D model - Other - DFNW5 5x6  FULL−CUT SO8FL WF) CASE 507BA ISSUE A
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NVMFWS2D9N04XMT1G Details

  • Manufacturer Part Number:

    NVMFWS2D9N04XMT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW5 4.90x5.90x1.00, 1.27P

  • Manufacturer Package Code:

    507BA

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    133 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    25 A

  • Drain-source On Resistance-Max:

    0.0031 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    12.3 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    440 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVMFWS2D9N04XMT1G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance can be found in the onsemi application note AND9004/D, which provides guidelines for thermal design and layout considerations.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using thermal management techniques such as heat sinks or thermal interfaces to reduce the junction temperature.
  • The maximum allowed voltage stress on the NVMFWS2D9N04XMT1G is specified in the datasheet as 20V. Exceeding this voltage may cause permanent damage to the device.
  • To prevent ESD damage, follow proper ESD handling and assembly procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. The device is designed to withstand ESD events up to 2kV per the Human Body Model (HBM) and 200V per the Machine Model (MM).
  • The recommended soldering conditions for the NVMFWS2D9N04XMT1G can be found in the onsemi application note AND9003/D, which provides guidelines for soldering and assembly.

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NVMFWS2D9N04XMT1G Overview

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