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NVMTS4D3N15MC - onsemi

Description: Small Footprint (8x8 mm); Low RDS(on); Low QG and Capacitance; Wettable Flank Option; AEC−Q101 Qualified and PPAP Capable; RoHS Compliant

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PCB Footprints
NVMTS4D3N15MC - onsemi PCB footprint - Other - Other - DFNW8 8.3x8.4, 2P CASE 507AP ISSUE A
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NVMTS4D3N15MC - onsemi  - 3D model - Other - DFNW8 8.3x8.4, 2P CASE 507AP ISSUE A
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NVMTS4D3N15MC Details

  • Manufacturer Part Number:

    NVMTS4D3N15MC

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    DFNW-8

  • Manufacturer Package Code:

    507AP

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.2

  • Avalanche Energy Rating (Eas):

    3390 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    165 A

  • Drain-source On Resistance-Max:

    0.00445 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    12.5 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    292 W

  • Pulsed Drain Current-Max (IDM):

    900 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NVMTS4D3N15MC Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the NVMTS4D3N15MC is -55°C to 150°C.
  • To ensure proper biasing, the device requires a Vgs (gate-source voltage) of 0V to 5V, and a Vds (drain-source voltage) of 0V to 150V. Additionally, the device should be operated within the recommended operating conditions specified in the datasheet.
  • For optimal thermal performance, it is recommended to use a PCB with a thermal pad and to ensure good thermal conductivity between the device and the heat sink. A minimum of 2oz copper thickness is recommended for the PCB. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended.
  • To protect the device from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded. Additionally, it is recommended to use an ESD protection device, such as a TVS diode, in the circuit design.
  • The recommended gate drive circuitry for the NVMTS4D3N15MC includes a gate driver IC with a high current capability (e.g. 1A or higher) and a low output impedance. The gate driver should be able to provide a fast rise and fall time (e.g. <10ns) and a high voltage swing (e.g. 10V to 15V) to ensure proper device switching.

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NVMTS4D3N15MC Overview

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