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NVT2002DP,118 - NXP

Description: Translation - Voltage Levels Interface IC

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NVT2002DP,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8
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NVT2002DP,118 - NXP  - 3D model - Small Outline Packages - TSSOP8
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NVT2002DP,118 Details

  • Manufacturer Part Number:

    NVT2002DP,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-1

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Additional Feature:

    Also Required Vref(B) Supply 1.8 to 5.5V

  • Delay-Max:

    1.5 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NVT2002DP,118 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode choke or a ferrite bead to filter the power supply.
  • Use a shielded enclosure, keep the PCB away from the enclosure walls, and use a common mode choke or a ferrite bead to filter the power supply. Ensure that the PCB layout is optimized for EMC and that the device is properly grounded.
  • The maximum operating temperature range for NVT2002DP is -40°C to 125°C. However, the device may not function optimally at the extreme ends of this range, and thermal management is crucial to ensure reliable operation.
  • Yes, NVT2002DP is designed to withstand high vibrations. However, it's essential to ensure that the PCB is properly secured to the enclosure and that the device is properly soldered to the PCB to prevent mechanical stress.
  • Use a logic analyzer or an oscilloscope to monitor the device's signals. Check the power supply voltage, clock frequency, and data transmission rates. Verify that the device is properly configured and that the PCB layout is correct.

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NVT2002DP,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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