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NVT2002GD,125 - NXP

Description: Translation - Voltage Levels BIDIRCTIONL VOLT-LVL TRANSL O-DRN P-P APP

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NVT2002GD,125 - NXP PCB footprint - Other - Other - NVT2002GD,125-4
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3D Models
NVT2002GD,125 - NXP  - 3D model - Other - NVT2002GD,125-4
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NVT2002GD,125 Details

  • Manufacturer Part Number:

    NVT2002GD,125

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    XSON-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT996-2

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    Also Required Vref(B) Supply 1.8 to 5.5V

  • Delay-Max:

    1.5 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NVT2002GD,125 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Use a heat sink to keep the junction temperature below 125°C. Ensure good airflow and avoid thermal hotspots. Consider using a thermal interface material to improve heat transfer.
  • Choose a suitable transformer with a turns ratio that matches the input and output voltage requirements. Select capacitors with a high ripple current rating and low ESR. Ensure the input and output filters are properly designed to reduce EMI.
  • Use an oscilloscope to monitor the input and output waveforms. Check for proper decoupling and filtering. Verify the PCB layout and component selection. Consult the application notes and datasheet for guidance on troubleshooting common issues.
  • Use a shielded enclosure and ensure good grounding. Implement a common mode choke and differential mode filter to reduce EMI. Follow the layout guidelines in the datasheet and application notes to minimize radiation.

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NVT2002GD,125 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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