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NVT2003DP,118 - NXP

Description: Bidirectional voltage-level translator for open-drain and push-pull applications

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NVT2003DP,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP10
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NVT2003DP,118 - NXP  - 3D model - Small Outline Packages - TSSOP10
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NVT2003DP,118 Details

  • Manufacturer Part Number:

    NVT2003DP,118

  • Source Url Status Check Date:

    2013-10-15 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    SOT552-1

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-G10

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NVT2003DP,118 Frequently Asked Questions (FAQs)

  • A good PCB layout for NVT2003DP,118 involves keeping the input and output tracks as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure EMC with NVT2003DP,118, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Also, ensure that the PCB layout is optimized for EMC.
  • The maximum operating temperature range for NVT2003DP,118 is -40°C to 125°C. However, the device can be operated at a reduced temperature range for specific applications, but this should be discussed with NXP Semiconductors.
  • Yes, NVT2003DP,118 is suitable for high-reliability applications. It is manufactured using a high-reliability process, and NXP Semiconductors provides a range of reliability data, including FIT rates and MTBF calculations, to support high-reliability applications.
  • To troubleshoot issues with NVT2003DP,118, start by checking the power supply voltage, input signals, and output loads. Use an oscilloscope to check the input and output waveforms, and verify that the device is operating within the recommended operating conditions.

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NVT2003DP,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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