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NVT2008BQ,115 - NXP

Description: NXP - NVT2008BQ,115 - BIDIR VOLTAGE LEVEL TRANSLATOR, DHVQFN20

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PCB Footprints
NVT2008BQ,115 - NXP PCB footprint - Other - Other - NVT2008BQ,115-1
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NVT2008BQ,115 - NXP  - 3D model - Other - NVT2008BQ,115-1
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NVT2008BQ,115 Details

  • Manufacturer Part Number:

    NVT2008BQ,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    DHVQFN-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT764-1

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

  • Delay-Max:

    0.375 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    GTL TO TTL TRANSCEIVER

  • JESD-30 Code:

    R-PQCC-N20

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    8

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.1X.18,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.4 V

  • Supply Voltage-Nom:

    1 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    1.8 V

  • Supply Voltage1-Nom:

    2 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

NVT2008BQ,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 100nF) close to the device.
  • Follow the guidelines in the NXP application note AN11555 for EMC design considerations. Use a shielded enclosure, minimize loop areas, and add filtering components (e.g., ferrite beads, chokes) to reduce emissions.
  • The NVT2008BQ,115 is specified to operate from -40°C to 125°C (junction temperature). However, the recommended operating temperature range is -20°C to 85°C for optimal performance and reliability.
  • Yes, the NVT2008BQ,115 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, ensure that your design meets the specific requirements of your target application.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the power supply, clock, and reset signals. Consult the NXP support resources, application notes, and datasheet for troubleshooting guidelines.

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NVT2008BQ,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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