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NVT4557HKX - NXP

Description: Translation - Voltage Levels SIM card interface level translator and supply voltage without LDO

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NVT4557HKX - NXP - PCB symbol
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PCB Footprints
NVT4557HKX - NXP PCB footprint - Other - Other - NVT4557HKX-3
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3D Models
NVT4557HKX - NXP - 3D model - Other - NVT4557HKX-3
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NVT4557HKX Details

  • Manufacturer Part Number:

    NVT4557HKX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    XQFN-10

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Delay-Max:

    25 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PQCC-N10

  • Length:

    1.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XQCCN

  • Package Equivalence Code:

    LCC10,.05X0.07,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, EXTREMELY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.08 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    1.62 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.4 mm

NVT4557HKX Frequently Asked Questions (FAQs)

  • A good PCB layout for the NVT4557HKX involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and decouple it with a 10uF capacitor to ground. The VBIAS pin should be connected to a voltage divider network that sets the desired output voltage. The EN pin should be tied to a logic high or low depending on the desired enable state.
  • The NVT4557HKX has a thermal pad that must be connected to a heat sink or a thermal via to ensure proper heat dissipation. The device can operate up to 125°C, but the junction temperature should be kept below 115°C for optimal reliability. A thermal interface material can be used to improve heat transfer between the device and the heat sink.
  • To troubleshoot issues with the NVT4557HKX, start by verifying the power supply voltage and decoupling. Check the input and output waveforms using an oscilloscope to identify any anomalies. Verify that the device is properly biased and that the enable pin is in the correct state. If issues persist, consult the NXP Semiconductors application note for the NVT4557HKX.
  • The NVT4557HKX has built-in ESD protection, but it is still important to follow proper ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment. Avoid touching the device pins or exposing them to static electricity.

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NVT4557HKX Overview

Use the download button to access the NVT4557HKX schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NVT45, or try a keyword search, such as Level Translators

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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