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NVTFWS014P04M8LTAG - onsemi

Description: Small Footprint (3x3 mm); Low RDS on ; Low Capacitance; AEC−Q101 Qualified and PPAP Capable; These Devices are Pb−Free, Halogen Free/BFR−Free and are RoHS Compliant

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PCB Footprints
NVTFWS014P04M8LTAG - onsemi PCB footprint - Other - Other - WDFNW8 3.3x3.3, 0.65P (Full−Cut 8FL WF) CASE 515AN ISSUE O_24
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3D Models
NVTFWS014P04M8LTAG - onsemi  - 3D model - Other - WDFNW8 3.3x3.3, 0.65P (Full−Cut 8FL WF) CASE 515AN ISSUE O_24
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NVTFWS014P04M8LTAG Details

  • Manufacturer Part Number:

    NVTFWS014P04M8LTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFNW8 3.3x3.3, 0.65P (Full−Cut ?8FL WF)

  • Manufacturer Package Code:

    515AN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2019-12-04

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    143 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    49 A

  • Drain-source On Resistance-Max:

    0.0138 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    61 W

  • Pulsed Drain Current-Max (IDM):

    224 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NVTFWS014P04M8LTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The device has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the NVTFWS014P04M8LTAG is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions and derating guidelines.
  • Use a thermal imaging camera to identify hotspots, and check for proper PCB layout and thermal design. Verify that the device is operated within the recommended specifications, and check for any signs of physical damage or contamination.

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NVTFWS014P04M8LTAG Overview

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