NX3DV221GM - NXP

NX3DV221GM Details

• Manufacturer Part Number:

  NX3DV221GM

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFN

• Package Description:

  2 X 1.55 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT1049-2, QFN-10

• Pin Count:

  10

• Country Of Origin:

  Thailand

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Analog IC - Other Type:

  DIFFERENTIAL MULTIPLEXER

• JESD-30 Code:

  R-PQCC-N10

• JESD-609 Code:

  e4

• Length:

  2 mm

• Moisture Sensitivity Level:

  1

• Normal Position:

  NC

• Number of Channels:

  6

• Number of Functions:

  1

• Number of Terminals:

  10

• Off-state Isolation-Nom:

  38 dB

• On-state Resistance Match-Nom:

  0.1 Ω

• On-state Resistance-Max (Ron):

  7 Ω

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  SEPARATE OUTPUT

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VQCCN

• Package Equivalence Code:

  LCC10,.06X.08,20

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.3 V

• Supply Voltage-Nom (Vsup):

  2.5 V

• Surface Mount:

  YES

• Switch-off Time-Max:

  23 ns

• Switch-on Time-Max:

  50 ns

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.58 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.55 mm