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NX3DV42GU10X - NXP

Description: USB Switch ICs Dble-pole Dble- throw analog switch

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PCB Footprints
NX3DV42GU10X - NXP PCB footprint - Other - Other - XQFN10(SOT1337-1)
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3D Models
NX3DV42GU10X - NXP  - 3D model - Other - XQFN10(SOT1337-1)
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NX3DV42GU10X Details

  • Manufacturer Part Number:

    NX3DV42GU10X

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    XQFN-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    SOT1337-1

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    R-PQCC-N10

  • Length:

    1.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    30 dB

  • On-state Resistance Match-Nom:

    0.65 Ω

  • On-state Resistance-Max (Ron):

    10 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XQCCN

  • Package Equivalence Code:

    LCC10,.05X.06,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, EXTREMELY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    0.01 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    30 ns

  • Switch-on Time-Max:

    40 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.3 mm

NX3DV42GU10X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • The input signal rise and fall times should be <10 ns. The output signal rise and fall times are typically <5 ns. Ensure signal integrity by maintaining a signal bandwidth of <100 MHz.
  • Implement ESD protection using TVS diodes or ESD arrays on the input and output pins. Ensure the protection devices are rated for the maximum voltage and current of the application.
  • Use a combination of ceramic and electrolytic capacitors for power supply decoupling. Implement a pi-filter or a common-mode choke to reduce electromagnetic interference (EMI).

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NX3DV42GU10X Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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