NX3DV642GU,115 - NXP

NX3DV642GU,115 Details

• Manufacturer Part Number:

  NX3DV642GU,115

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  XQFN-24

• Pin Count:

  QFN

• Manufacturer Package Code:

  SOT1310-1

• Country Of Origin:

  Mainland China, Taiwan

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Analog IC - Other Type:

  3PDT

• JESD-30 Code:

  R-PQCC-N24

• Length:

  3.4 mm

• Moisture Sensitivity Level:

  1

• Normal Position:

  NO/NC

• Number of Channels:

  6

• Number of Functions:

  2

• Number of Terminals:

  24

• Off-state Isolation-Nom:

  35 dB

• On-state Resistance Match-Nom:

  0.65 Ω

• On-state Resistance-Max (Ron):

  14 Ω

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  SEPARATE OUTPUT

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VQCCN

• Package Equivalence Code:

  LCC24,.1X.14,16

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.5 mm

• Signal Current-Max:

  0.1 A

• Supply Current-Max (Isup):

  0.002 mA

• Supply Voltage-Max (Vsup):

  4.3 V

• Supply Voltage-Min (Vsup):

  2.65 V

• Supply Voltage-Nom (Vsup):

  2.775 V

• Surface Mount:

  YES

• Switching:

  BREAK-BEFORE-MAKE

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  2.5 mm