NX3L1G3157GW,125 - NXP

NX3L1G3157GW,125 Details

• Manufacturer Part Number:

  NX3L1G3157GW,125

• Source Url Status Check Date:

  2013-06-14 00:00:00

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TSSOP

• Package Description:

  PLASTIC, SOT-363, SC-88, 6 PIN

• Pin Count:

  6

• Manufacturer Package Code:

  SOT363

• HTS Code:

  8542.39.00.60

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Analog IC - Other Type:

  SPDT

• JESD-30 Code:

  R-PDSO-G6

• JESD-609 Code:

  e3

• Length:

  2 mm

• Moisture Sensitivity Level:

  1

• Normal Position:

  NO/NC

• Number of Functions:

  1

• Number of Terminals:

  6

• Off-state Isolation-Nom:

  90 dB

• On-state Resistance Match-Nom:

  0.2 Ω

• On-state Resistance-Max (Ron):

  1.7 Ω

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  COMMON OUTPUT

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP6,.08

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max (Vsup):

  4.3 V

• Supply Voltage-Min (Vsup):

  1.4 V

• Supply Voltage-Nom (Vsup):

  1.65 V

• Surface Mount:

  YES

• Switch-off Time-Max:

  30 ns

• Switch-on Time-Max:

  52 ns

• Switching:

  BREAK-BEFORE-MAKE

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.25 mm