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NX3L1G384GM,132 - NXP

Description: Analog Switch ICs Analog SW Single SPST 3.6V 5-Pin

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NX3L1G384GM,132 - NXP - PCB symbol
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PCB Footprints
NX3L1G384GM,132 - NXP PCB footprint - Other - Other - SOT-886
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3D Models
NX3L1G384GM,132 - NXP - 3D model - Other - SOT-886
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NX3L1G384GM,132 Details

  • Manufacturer Part Number:

    NX3L1G384GM,132

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    XSON-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT886

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance-Max (Ron):

    4.1 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, EXTREMELY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Signal Current-Max:

    0.35 A

  • Supply Current-Max (Isup):

    0.007 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    21 ns

  • Switch-on Time-Max:

    48 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NX3L1G384GM,132 Frequently Asked Questions (FAQs)

  • A good PCB layout for the NX3L1G384GM,132 involves keeping the analog and digital grounds separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, ensure that the input and output tracks are short and direct to minimize signal degradation.
  • The NX3L1G384GM,132 has a thermal pad on the bottom, which should be connected to a solid ground plane or a thermal vias to dissipate heat. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if operating in high-temperature environments.
  • The NX3L1G384GM,132 can operate up to 400 MHz, but the maximum frequency depends on the specific application and signal integrity requirements. It's recommended to consult the datasheet and application notes for specific frequency-related guidelines.
  • The output stage of the NX3L1G384GM,132 can be configured for various output impedances and slew rates. Consult the datasheet and application notes for specific configuration guidelines, and consider using external resistors or capacitors to optimize the output stage for your application.
  • The NX3L1G384GM,132 has built-in ESD protection and latch-up prevention mechanisms. However, it's still important to follow proper handling and assembly procedures to prevent damage. Consult the datasheet and application notes for specific guidelines on ESD protection and latch-up prevention.

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NX3L1G384GM,132 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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