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NX3L1T3157GM,115 - NXP

Description: Analog Switch ICs LV .5 LOW-OHM 1P-1T

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NX3L1T3157GM,115 - NXP - PCB symbol
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PCB Footprints
NX3L1T3157GM,115 - NXP PCB footprint - Other - Other - NX3L1T3157GM,115-2
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NX3L1T3157GM,115 - NXP - 3D model - Other - NX3L1T3157GM,115-2
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NX3L1T3157GM,115 Details

  • Manufacturer Part Number:

    NX3L1T3157GM,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    XSON-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT886

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    1.45 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    90 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    4.1 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.5 mm

  • Signal Current-Max:

    0.5 A

  • Supply Current-Max (Isup):

    0.006 mA

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    1.4 V

  • Supply Voltage-Nom (Vsup):

    1.65 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    90 ns

  • Switch-on Time-Max:

    120 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

NX3L1T3157GM,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for the NX3L1T3157GM,115 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper powering and decoupling, use a low-ESR capacitor (e.g., 100nF) between VCC and GND, and a larger capacitor (e.g., 10uF) for bulk decoupling. Place these capacitors close to the device, and use a low-impedance power supply.
  • The NX3L1T3157GM,115 has a thermal junction-to-ambient resistance of 125°C/W. Ensure good airflow, use a heat sink if necessary, and avoid blocking the thermal pad. Keep the device away from heat sources and ensure a maximum junction temperature of 150°C.
  • Use ESD protection devices (e.g., TVS diodes) on the input and output lines, and ensure the PCB design includes ESD protection features such as guard rings and ESD-protected I/Os. Handle the device by the body, not the pins, and use an anti-static wrist strap or mat.
  • Use a high-impedance probe or a differential probe to measure the output, and a low-capacitance probe for input measurements. Use a signal generator with a 50Ω output impedance, and a 50Ω termination at the load. Ensure the measurement setup is well-shielded and grounded.

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NX3L1T3157GM,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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