NX3L2267GU,115 - NXP

NX3L2267GU,115 Details

• Manufacturer Part Number:

  NX3L2267GU,115

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFN

• Package Description:

  XQFN-10

• Pin Count:

  10

• Manufacturer Package Code:

  SOT1160-1

• Country Of Origin:

  Mainland China, Taiwan, Thailand

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  7

• Analog IC - Other Type:

  SPDT

• JESD-30 Code:

  R-PQCC-N10

• JESD-609 Code:

  e4

• Length:

  2 mm

• Moisture Sensitivity Level:

  1

• Normal Position:

  NO

• Number of Channels:

  1

• Number of Functions:

  2

• Number of Terminals:

  10

• Off-state Isolation-Nom:

  90 dB

• On-state Resistance Match-Nom:

  0.2 Ω

• On-state Resistance-Max (Ron):

  4.1 Ω

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  SEPARATE OUTPUT

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  QCCN

• Package Equivalence Code:

  LCC10,.06X.07,16

• Package Shape:

  RECTANGULAR

• Package Style:

  CHIP CARRIER

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Max (Vsup):

  4.3 V

• Supply Voltage-Min (Vsup):

  1.4 V

• Supply Voltage-Nom (Vsup):

  1.65 V

• Surface Mount:

  YES

• Switch-off Time-Max:

  90 ns

• Switch-on Time-Max:

  90 ns

• Switching:

  BREAK-BEFORE-MAKE

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  1.55 mm