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NX7002AKS,115 - Nexperia

Description: MOSFET 60 V,Dual N-chan Trench MOSFET

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PCB Footprints
NX7002AKS,115 - Nexperia PCB footprint - Other - Other - SOT363 (TSSOP6)
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3D Models
NX7002AKS,115 - Nexperia  - 3D model - Other - SOT363 (TSSOP6)
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NX7002AKS,115 Details

  • Manufacturer Part Number:

    NX7002AKS,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, SOT-363, TSSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.17 A

  • Drain-source On Resistance-Max:

    5.2 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    1.4 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.06 W

  • Pulsed Drain Current-Max (IDM):

    0.68 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NX7002AKS,115 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and consider using a heat sink with a high thermal conductivity.
  • The NX7002AKS,115 has internal ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling to prevent damage.
  • Yes, the NX7002AKS,115 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, ensure that the device is used within the specified operating conditions and follow proper design and testing guidelines.
  • Use a systematic approach to troubleshoot, checking for proper power supply, signal integrity, and thermal management. Consult the datasheet and application notes for guidance, and consider contacting Nexperia's technical support if issues persist.

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NX7002AKS,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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