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NYC0102BLT1G - onsemi

Description: Silicon Controlled Rectifier, 200V 0.25A, 200uA 3-pin, SOT-23

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PCB Footprints
NYC0102BLT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
NYC0102BLT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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NYC0102BLT1G Details

  • Manufacturer Part Number:

    NYC0102BLT1G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    SOT-23

  • Package Description:

    LEAD FREE, CASE 318-08, TO-236, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318-08

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    onsemi

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    200 V/us

  • DC Gate Trigger Current-Max:

    0.2 mA

  • DC Gate Trigger Voltage-Max:

    0.8 V

  • Holding Current-Max:

    6 mA

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    7 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    0.25 A

  • Repetitive Peak Off-state Voltage:

    200 V

  • Repetitive Peak Reverse Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Trigger Device Type:

    SCR

NYC0102BLT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1-inch square copper pad for heat sinking.
  • Implement a heat sink with a thermal resistance of 10°C/W or lower, and ensure good airflow around the device. Consider using a thermal interface material (TIM) for improved heat transfer.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C, and a dwell time of 20-30 seconds. Avoid wave soldering or hand soldering, as it may damage the device.
  • Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Consider using a vibration-dampening material, such as a silicone-based adhesive, to reduce stress on the device.
  • Use an ESD wrist strap or mat, and ensure all equipment and tools are grounded. Handle the device by the body or pins, avoiding direct contact with the die. Use an anti-static bag or packaging when storing or shipping the device.

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NYC0102BLT1G Overview

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