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NZ9F16VT5G - onsemi

Description: Standard Zener Breakdown Voltage Range 2.4 V to 24 V; Steady State Power Rating of 250 mW; Small Body Outline Dimensions: 0.039 x 0.024 (1.00 mm x 0.60 mm); Low Body Height: 0.016 (0.40 mm); ESD Rating of Class 3 (>16 kV) per Human Body Model; These are PbFree Devices

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NZ9F16VT5G - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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NZ9F16VT5G - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD-923 CASE 514AB
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NZ9F16VT5G Details

  • Manufacturer Part Number:

    NZ9F16VT5G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-923, 1.0x0.6, 0.40 Max Height

  • Pin Count:

    2

  • Manufacturer Package Code:

    514AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    50 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    80 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.2 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Reference Voltage-Nom:

    16 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Temp Coeff-Max:

    14 mV/°C

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    5 mA

NZ9F16VT5G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for good airflow.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper PCB design guidelines.
  • The recommended soldering conditions for the NZ9F16VT5G include a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C.
  • To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or die, and store the device in an ESD-protected package. Additionally, follow proper ESD handling procedures during assembly and testing.
  • The recommended storage conditions for the NZ9F16VT5G include a temperature range of -40°C to 125°C, a humidity level below 60%, and protection from direct sunlight and moisture. It's also essential to store the device in its original packaging or an ESD-protected package.

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NZ9F16VT5G Overview

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