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OP291GSZ-REEL - Analog Devices

Description: Op Amp Dual Micropower Amplifier R-R I/O ±6V/12V 8-Pin SOIC N T/R

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OP291GSZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-8 (SOIC)
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OP291GSZ-REEL Details

  • Manufacturer Part Number:

    OP291GSZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    LEAD FREE, PLASTIC, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.095 µA

  • Bias Current-Max (IIB) @25C:

    0.065 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    97 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1250 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -8 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    1.1 mA

  • Supply Voltage Limit-Max:

    8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    25000

  • Wideband:

    NO

  • Width:

    3.9 mm

OP291GSZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for OP291GSZ-REEL involves keeping the input and output traces short and symmetrical, using a solid ground plane, and minimizing noise coupling. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain and phase margins are sufficient, and the output impedance is low. Also, use a compensation capacitor (e.g., 10nF) between the output and the inverting input to prevent oscillations.
  • The maximum power dissipation of OP291GSZ-REEL is 670mW, which is calculated based on the maximum junction temperature (150°C) and thermal resistance (125°C/W).
  • Yes, OP291GSZ-REEL is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
  • Use ESD protection devices (e.g., TVS diodes) and overvoltage protection circuits (e.g., voltage clamps) to protect OP291GSZ-REEL from electrostatic discharge and overvoltage events.

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OP291GSZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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