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ORNTA1002AT1 - Vishay

Description: Resistor Networks & Arrays 10Kohms 0.1%ABS 0.05%RATIO

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ORNTA1002AT1 - Vishay - PCB symbol
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PCB Footprints
ORNTA1002AT1 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - PACKAGE CASE MS-012AA
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ORNTA1002AT1 - Vishay - 3D model - Small Outline Packages - PACKAGE CASE MS-012AA
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ORNTA1002AT1 Details

  • Manufacturer Part Number:

    ORNTA1002AT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.20

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.5

  • Construction:

    Rectangular

  • Element Power Dissipation:

    0.1 W

  • First Element Resistance:

    10000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.73 mm

  • Package Length:

    4.9 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.9 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.4 W

  • Rated Temperature:

    70 °C

  • Resistance:

    10000 Ω

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    10000 Ω

  • Size Code:

    1915

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Temperature Coefficient Tracking:

    5 ppm/°C

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    GULL WING

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

ORNTA1002AT1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for ORNTA1002AT1 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a thermal pad size of 1.1 mm x 0.6 mm. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area for the thermal pad.
  • To ensure reliable soldering of ORNTA1002AT1, use a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component.
  • The maximum power dissipation of ORNTA1002AT1 is 1 W, with a thermal resistance (RθJA) of 125°C/W. The device can operate at a maximum junction temperature of 150°C.
  • Yes, ORNTA1002AT1 is suitable for high-frequency applications up to 1 GHz. However, the device's performance may degrade at higher frequencies due to parasitic inductance and capacitance. It is recommended to use a suitable PCB layout and component selection to minimize these effects.
  • Yes, ORNTA1002AT1 is compatible with lead-free soldering processes. The device is RoHS-compliant and can be soldered using lead-free solder alloys with a melting point of 217°C to 220°C.

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ORNTA1002AT1 Overview

Use the download button to access the ORNTA1002AT1 schematic symbol, PCB footprint, and 3D model.
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ORNTA1002AT1 Alternates

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Image Part Number Model
Part Image ORNTA1002ATS Vishay Thin Film

RESISTOR, NETWORK, FILM, ISOLATED, 0.4 W, SURFACE MOUNT, 1620, DIP, ROHS COMPLIANT
Part Image DFNA1002AT0 Vishay Thin Film

RESISTOR, NETWORK, FILM, ISOLATED, 0.4 W, SURFACE MOUNT, 1616, SOIC, ROHS COMPLIANT
Part Image ORNTA1002AT0 Vishay Intertechnologies

Array/Network Resistor, Isolated, Thin Film, 0.4W, 10000ohm, 100V, 0.1% +/-Tol, 25ppm/Cel, Surface Mount, 1915, CHIP
Part Image ORNA1002AUF Vishay Thin Film

RESISTOR, NETWORK, FILM, ISOLATED, 0.4 W, SURFACE MOUNT, 1620, DIP
Part Image DFNA1002AUF Vishay Thin Film

RESISTOR, NETWORK, FILM, ISOLATED, 0.4 W, SURFACE MOUNT, 1616, SOIC, ROHS COMPLIANT
For a full list of alternate parts for ORNTA1002AT1, check out Findchips.com