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OSD3358-1G-ISM - Octavo Systems

Description: System-On-Modules - SOM System-in-Package: Texas Instruments AM3358 ARM Cortex A8 Processor, 1GBB DDR3, TPS65217C PMIC, TL5209 LDO, 4KB EEPROM, Passives - 21mm X 21mm 256 Ball BGA - -40 C to 85 C

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OSD3358-1G-ISM - Octavo Systems - PCB symbol
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PCB Footprints
OSD3358-1G-ISM - Octavo Systems PCB footprint - BGA - BGA - 256-BGA Ball Grid Array (BGA).
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3D Models
OSD3358-1G-ISM - Octavo Systems - 3D model - BGA - 256-BGA Ball Grid Array (BGA).
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OSD3358-1G-ISM Details

  • Manufacturer Part Number:

    OSD3358-1G-ISM

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    BGA-256

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Octavo Systems LLC

  • JESD-30 Code:

    S-PBGA-B256

  • Length:

    21 mm

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Seated Height-Max:

    2.58 mm

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

OSD3358-1G-ISM Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the OSD3358-1G-ISM is -40°C to 85°C.
  • The PMIC on the OSD3358-1G-ISM is configured through the I2C interface. You can use the TI Fusion Power Designer software to generate the configuration files and then program the PMIC using the I2C interface.
  • The maximum current draw of the OSD3358-1G-ISM depends on the operating mode and the peripherals used. However, the typical current draw is around 1.5A during normal operation.
  • Power sequencing on the OSD3358-1G-ISM can be implemented using the PMIC's power sequencing pins and the system's power management IC. You can use the TI Fusion Power Designer software to generate the power sequencing configuration files.
  • The maximum frequency of the DDR3L memory interface on the OSD3358-1G-ISM is 1600MT/s.

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OSD3358-1G-ISM Overview

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