Part Image

OSDZU3EG1-2G-HFA - Octavo Systems

Description: System-On-Modules - SOM System-in-Package: AMD Zynq UltraScale+ MPSoC ZU3, 2GB LPDDR4, Power Management System, 32MB 3V3 NOR QSPI, Osciallator, Passives - 20.5mmX40mm 600 Ball BGA - 40C to 100C

Download OSDZU3EG1-2G-HFA Model

Schematic
symbols

PCB
footprints

3D
models

Alert me if there are changes to this OSDZU3EG1-2G-HFA model

Email notifications will be applied after download.

Send part feedback

Symbol

OSDZU3EG1-2G-HFA - Octavo Systems - PCB symbol

PCB Footprints

OSDZU3EG1-2G-HFA - Octavo Systems PCB footprint - BGA - BGA - 600 ball BGA 20.5mmx40mm

3D Models

OSDZU3EG1-2G-HFA - Octavo Systems - 3D model - BGA - 600 ball BGA 20.5mmx40mm

Datasheet Download Datasheet
Stock & Prices Price & Stock for OSDZU3EG1-2G-HFA
Part Number OSDZU3EG1-2G-HFA
Manufacturer Octavo Systems
Pin Count 600
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - 600 ball BGA 20.5mmx40mm
Released Date Jun 23, 2025
Last Modified Date Jun 23, 2025 8:22 AM UTC
Pinout / Pin List Click Here (Member Only)

OSDZU3EG1-2G-HFA Details

Manufacturer Part Number:
OSDZU3EG1-2G-HFA
Manufacturer:
Octavo Systems LLC

Trust Checks

Community Provided

System Verified

Community Approved

OSDZU3EG1-2G-HFA Overview

Use the download button to access the OSDZU3EG1-2G-HFA schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like OSDZU, or try a keyword search, such as Photo Diodes

Parts related to OSDZU3EG1-2G-HFA

Showing 0 results