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P1330R-823K - API Delevan

Description: API Type 1330 Wire-wound SMD Inductor with a Ferrite Core, 82 µH ±10% Wire-Wound 362mA Idc

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PCB Footprints
P1330R-823K - API Delevan PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 7.94x2.925x3.68mm
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3D Models
P1330R-823K - API Delevan  - 3D model - Inductors Precision Moulded - 7.94x2.925x3.68mm
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P1330R-823K Details

  • Manufacturer Part Number:

    P1330R-823K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    API Delevan

  • YTEOL:

    7

  • Case/Size Code:

    3313

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.38 Ω

  • Inductance-Nom (L):

    82 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.68 mm

  • Package Length:

    8.26 mm

  • Package Style:

    SMT

  • Package Width:

    3.18 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    0.362 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

P1330R-823K Frequently Asked Questions (FAQs)

  • The recommended PCB land pattern for the P1330R-823K is a rectangular pad with a minimum size of 50 mils x 30 mils, with a non-solder mask defined (NSMD) pad shape.
  • The P1330R-823K has a maximum operating temperature of 125°C. Ensure good airflow around the component, and consider using a thermal interface material (TIM) to improve heat dissipation.
  • The recommended soldering profile for the P1330R-823K is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. Use a solder with a melting point above 217°C.
  • Yes, the P1330R-823K is designed to withstand vibrations up to 20 G's. However, ensure proper PCB mounting and secure the component to prevent movement during operation.
  • Use shielding, filtering, and proper PCB layout techniques to minimize EMI. The P1330R-823K has a magnetic shielding option available; consult with API Delevan for custom shielding designs.

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P1330R-823K Overview

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Part Image P1330-823K API Delevan

General Purpose Inductor, 82uH, 10%, 1 Element, Ferrite-Core, SMD, 3313