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P2500X - Diotec

Description: Rectifiers Diode, P600, 1800V, 25A

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P2500X - Diotec PCB footprint - Other - Other - P2500X-1
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P2500X Details

  • Manufacturer Part Number:

    P2500X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    6.18

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    550 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    1800 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    1.5 µs

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

P2500X Frequently Asked Questions (FAQs)

  • A good PCB layout for the P2500X should include a large copper area for heat dissipation, with multiple vias to the bottom layer to reduce thermal resistance. A minimum of 2oz copper thickness is recommended. Additionally, keep the component placement and routing symmetrical to minimize thermal gradients.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the P2500X. Also, consider using a heat sink with a thermal interface material (TIM) to reduce the junction-to-case thermal resistance. Ensure good airflow around the device, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • When using the P2500X in a high-frequency switching application, consider the device's switching losses, which can lead to increased junction temperatures. Ensure that the PCB layout is optimized for high-frequency operation, with minimal parasitic inductance and capacitance. Additionally, consider using a snubber circuit to reduce voltage overshoots and ringing.
  • To protect the P2500X from EOS and ESD, follow proper handling and storage procedures. Use an ESD wrist strap or mat when handling the device, and ensure that the PCB is designed with ESD protection in mind, such as using TVS diodes or ESD protection arrays. Also, consider using a voltage clamp or surge protector to limit voltage transients.
  • When deciding between using the P2500X in a linear versus switching regulator application, consider the trade-offs between efficiency, power density, and complexity. Linear regulators offer simplicity and low noise, but are less efficient and have lower power density. Switching regulators offer higher efficiency and power density, but are more complex and may require additional components.

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P2500X Overview

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