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P3MS650103H-4CR - onsemi

Description: PLL Clock Synthesizer, 15 -> 60 MHz, 4-pin WDFN

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P3MS650103H-4CR - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN4 CASE 511BS-01 ISSUE O
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P3MS650103H-4CR - onsemi  - 3D model - Small Outline No-lead - WDFN4 CASE 511BS-01 ISSUE O
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P3MS650103H-4CR Details

  • Manufacturer Part Number:

    P3MS650103H-4CR

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DFN

  • Package Description:

    1.20 X 1 MM, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, WDFN-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    511BS

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES FROM 2.3 TO 3.6V SUPPLY

  • Family:

    3M

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-N4

  • JESD-609 Code:

    e4

  • Length:

    1.2 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Number of True Outputs:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    2 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

  • fmax-Min:

    30 MHz

P3MS650103H-4CR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device. Additionally, consider using thermal interface materials and following proper soldering and assembly techniques.
  • The recommended soldering conditions for the P3MS650103H-4CR include a peak temperature of 260°C, a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C. It's also recommended to use a solder with a melting point of 217°C or higher.
  • To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or die, and store the device in an ESD-protective package. It's also recommended to follow proper ESD handling procedures and use ESD-protected equipment.
  • The recommended storage conditions for the P3MS650103H-4CR include a temperature range of -40°C to 125°C, a humidity level of 60% or less, and protection from direct sunlight and moisture. It's also recommended to store the device in its original packaging or an ESD-protective package.

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P3MS650103H-4CR Overview

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