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P6SMB12CAT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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PCB Footprints
P6SMB12CAT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
P6SMB12CAT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03
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P6SMB12CAT3G Details

  • Manufacturer Part Number:

    P6SMB12CAT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403C-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    12.6 V

  • Breakdown Voltage-Min:

    11.4 V

  • Breakdown Voltage-Nom:

    12 V

  • Clamping Voltage-Max:

    16.7 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    10.2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB12CAT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the P6SMB12CAT3G is a standard SOD-123 footprint with a pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum allowable voltage stress on the P6SMB12CAT3G is 12V, which is the rated working voltage. Exceeding this voltage can cause damage to the device.
  • The P6SMB12CAT3G is rated for operation up to 150°C. At high temperatures, the device's leakage current may increase, and its breakdown voltage may decrease. Ensure proper thermal management to prevent overheating.
  • While the P6SMB12CAT3G is primarily designed for low-frequency applications, it can be used in high-frequency circuits up to 100 kHz. However, be aware that the device's parasitic capacitance and inductance may affect circuit performance at high frequencies.

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P6SMB12CAT3G Overview

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