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P6SMB22CAT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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Symbol
P6SMB22CAT3G - onsemi - PCB symbol
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PCB Footprints
P6SMB22CAT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03
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3D Models
P6SMB22CAT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03
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P6SMB22CAT3G Details

  • Manufacturer Part Number:

    P6SMB22CAT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    LEAD FREE, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403C-01

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    23.1 V

  • Breakdown Voltage-Min:

    20.9 V

  • Breakdown Voltage-Nom:

    22 V

  • Clamping Voltage-Max:

    30.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    18.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB22CAT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for P6SMB22CAT3G can be found in the onsemi application note AND8308/D, which provides guidelines for surface mount assembly of SMB packages.
  • To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider the maximum junction temperature (Tj) of 150°C. Additionally, proper thermal management, such as heat sinking and airflow, should be implemented to keep the device temperature within the recommended operating range.
  • While the P6SMB22CAT3G is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance. It is recommended to consult with onsemi application engineers for specific guidance on high-frequency applications.
  • The recommended soldering profile for P6SMB22CAT3G is a peak temperature of 260°C for 10-30 seconds, with a maximum temperature ramp rate of 3°C/s. This profile is in accordance with the IPC/JEDEC J-STD-020 standard for surface mount devices.
  • Yes, the P6SMB22CAT3G is compatible with lead-free soldering processes. The device is constructed with lead-free materials and is suitable for use in RoHS-compliant applications.

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P6SMB22CAT3G Overview

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