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P6SMB24AT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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P6SMB24AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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P6SMB24AT3G - onsemi  - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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P6SMB24AT3G Details

  • Manufacturer Part Number:

    P6SMB24AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    25.2 V

  • Breakdown Voltage-Min:

    22.8 V

  • Breakdown Voltage-Nom:

    24 V

  • Clamping Voltage-Max:

    33.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    20.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB24AT3G Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for P6SMB24AT3G can be found in the onsemi application note AND8308/D, which provides guidelines for surface mount assembly of SMB packages.
  • The thermal considerations for P6SMB24AT3G can be handled by ensuring good thermal conductivity between the device and the PCB, using thermal vias, and providing adequate heat sinking. The device's thermal resistance (RθJA) is specified in the datasheet.
  • The maximum allowable voltage stress for P6SMB24AT3G is 24V, as specified in the datasheet. Exceeding this voltage may cause device damage or failure.
  • While P6SMB24AT3G is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance.
  • To ensure the reliability of P6SMB24AT3G, follow proper PCB design and assembly guidelines, use a suitable soldering process, and ensure that the device is operated within its specified ratings and conditions.

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P6SMB24AT3G Overview

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