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P6SMB36CAHE3/5B - Vishay

Description: TVS DIODE 30.8V 49.9V DO214AA

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Symbol
P6SMB36CAHE3/5B - Vishay - PCB symbol
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PCB Footprints
P6SMB36CAHE3/5B - Vishay PCB footprint - Diodes Moulded - Diodes Moulded - P6SMB36CAHE3/5B
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P6SMB36CAHE3/5B - Vishay - 3D model - Diodes Moulded - P6SMB36CAHE3/5B
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P6SMB36CAHE3/5B Details

  • Manufacturer Part Number:

    P6SMB36CAHE3/5B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMB, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY, HIGH RELIABILITY

  • Breakdown Voltage-Max:

    37.8 V

  • Breakdown Voltage-Min:

    34.2 V

  • Breakdown Voltage-Nom:

    36 V

  • Case Connection:

    ISOLATED

  • Clamping Voltage-Max:

    49.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    30.8 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB36CAHE3/5B Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for P6SMB36CAHE3/5B can be found in the Vishay Intertechnologies' application note AN483, which provides guidelines for surface mount assembly of SMB packages.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using thermal vias and thermal pads. Also, consider using a heat sink or a thermal interface material to improve heat dissipation.
  • The maximum allowable voltage stress for P6SMB36CAHE3/5B is 36V, as specified in the datasheet. Exceeding this voltage may lead to device failure or reduced reliability.
  • While P6SMB36CAHE3/5B is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 1 MHz. However, the device's performance may degrade at higher frequencies due to internal capacitance and inductance.
  • To ensure reliability in high-temperature environments, follow the recommended derating guidelines in the datasheet, and consider using a thermally conductive material to improve heat dissipation. Also, ensure that the device is operated within its specified temperature range (-55°C to 150°C).

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P6SMB36CAHE3/5B Overview

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