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P6SMB56AT3G - onsemi

Description: 600 Watt Peak Power Zener Transient Voltage Suppressors

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P6SMB56AT3G - onsemi - PCB symbol
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P6SMB56AT3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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P6SMB56AT3G - onsemi - 3D model - Diodes Moulded - SMB CASE 403A-03 ISSUE J
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P6SMB56AT3G Details

  • Manufacturer Part Number:

    P6SMB56AT3G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DO-214

  • Package Description:

    ROHS COMPLIANT, PLASTIC, CASE 403A-03, SMB, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    403A-03

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    58.8 V

  • Breakdown Voltage-Min:

    53.2 V

  • Breakdown Voltage-Nom:

    56 V

  • Clamping Voltage-Max:

    77 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.55 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    47.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

P6SMB56AT3G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for P6SMB56AT3G is a standard SMC (DO-214AB) package with a pad layout that ensures good thermal conduction and minimizes parasitic inductance. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure reliable soldering of P6SMB56AT3G, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Use a solder with a melting point below 260°C and avoid excessive soldering temperatures or times to prevent damage to the device.
  • The maximum allowable voltage stress on P6SMB56AT3G is 56V, which is the rated breakdown voltage of the device. However, it's recommended to derate the voltage stress to ensure reliable operation and prevent premature failure.
  • While P6SMB56AT3G is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 1 MHz with proper PCB layout and component selection. However, the device's performance may degrade at higher frequencies due to parasitic inductance and capacitance.
  • Select the right P6SMB56AT3G variant by considering factors such as the required breakdown voltage, peak pulse current, and operating temperature range. The datasheet provides a selection guide and a table of available variants to help with the selection process.

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P6SMB56AT3G Overview

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P6SMB56AT3G Alternates

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Part Image P6SMB56A-E3/52 Vishay Intertechnologies

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Part Image P6SMB56A SEMIKRON

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For a full list of alternate parts for P6SMB56AT3G, check out Findchips.com